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    AVX - Low-profile low-ESL multi-anode 'mirror' tantalum capacitor

    Published Jul 2 2007

    The TPM series of multi-anode 'mirror' configuration multianode tantalum capacitors has been developed by AVX, delivering reduced height, lower self inductance and lower equivalent series resistance, says the company.

    The new symmetrical design reduces ESL to 1nH - half that of standard D case sized devices. Low ESL enables a higher resonant frequency up to 500kHz (mirror D case), delivering more efficient filtering in DC-DC power switching converters. The new design also reduces the height of the new tantalum capacitors from 4.3mm (E case) to 3.1mm (D case) with even further reductions planned, down to 2mm maximum height

    Tomas Zednicek, worldwide technical marketing manager, said: "Common demands from designers of switch-mode power supplies, microprocessors, and general digital circuit applications are the reduction of noise while operating at higher frequencies - together with a downsizing of power supplies. This requires components with low Equivalent Series Resistance (ESR), high capacitance and high reliability. To achieve this, multi-anode internal designs have been used in applications such as telecoms infrastructure, networking, servers and even military/aerospace projects."

    The mirror anode configuration is also better for thermal power dissipation; hence higher ripple current can be achieved using only one capacitor. This allows downsizing of the power supply without compromising the output current ratings.

    Multianode mirror tantalums are available as D case devices within AVX's existing TPM series. Complying with RoHS requirements, TPM capacitors are designed for 3x reflow, 260C peak temperature lead-free assembly systems, and feature an operating temperature range of between -55C and +125C.

    Mirror TPM capacitors have a capacitance range of 10 to 1000uF, are rated at 2.5 to 50V and have an ESR range of 25 to140mohm. High voltage (35V and 50V) devices will be especially attractive for telecommunication applications where design height is becoming an important parameter: capacitance values 10 to 22uF, ESR 65-140mohm on a single 35 to 50V capacitor are difficult to attain within the 3.1mm maximum height using any other technology, says the company.
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